C.C. Wei

C.C. Wei said TSMC will bar customers from subleasing or auctioning their allocated wafer capacity, aiming to capture all AI demand value itself.

TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call...

Wei confirmed Terafab talks are ongoing but insisted any wafer fab must be operated by TSMC.

“We are still in discussion, let me say that,” Wei told analysts, per Bloomberg. He then added, "But the fab has got to be run by TSMC."

Wei argued TSMC is well-positioned for long-term AI demand, noting all AI players work with TSMC.

“All the AI players are working with TSMC,” he said.

Wei said AI chip demand remains strong with a still large supply gap, and AI accelerator CAGR for 2024-2029 could exceed the prior mid-to-high 50% forecast.

Wei said AI chip demand remained strong, with the supply gap still “quite big” and no signs of a slowdown, Investing.com reported.

Wei hinted TSMC would support customers who chose Intel's EMIB-T packaging but face supply shortfalls, prioritizing smooth product launches for customers.

I try to avoid answering it directly, but let me say that, yes, we will be. Number one priority I already indicated is that TSMC's customer's product can be introduced into the market smoothly. That's a number one priority. Okay?

Wei said TSMC is the only company mass-producing 5x reticle-size packages with excellent yields, and plans to expand to 9x and eventually 14x.

We are in the real-world production of 5x reticle size. I don't believe that anybody can do that today except at TSMC, and the yield is excellent. So our customers are very satisfied with the result.

C.C. Wei expects strong 3nm chip demand for years and says TSMC is building three new fabs to meet it.

Wei said TSMC expected strong demand for 3-nanometer chips for years and was building three new fabs to meet it.

C.C. Wei says TSMC is expanding at an unprecedented pace with about 20 fabs in development in Taiwan and overseas.

TSMC Chair and CEO C.C. Wei (魏哲家) said the company was expanding at an unprecedented pace. He said about 20 chip fabs were in development, including 13 chip foundries and packaging facilities in Taiwan and five to six overseas.

C.C. Wei says TSMC's Arizona 3nm fab is ahead of schedule, targeting production in Q3 2027.

On overseas expansion, Wei said TSMC’s 3-nanometer plant in Arizona was ahead of schedule, with equipment being installed ahead of production in the third quarter of 2027.

C.C. Wei says TSMC is converting some 5nm capacity to support 3nm production.

Wei said TSMC was shifting some 5-nanometer capacity to support 3-nanometer production.