Christophe Fouquet

Fouquet notes new low-NA EUV customers emerging, especially in DRAM, which validates broader EUV use.

We continue to see, in fact, new customer on low-NA EUV, especially when it comes to DRAM. I would say these go a bit beyond the T customer.

Fouquet says the AI build-out remains very robust and supply shortages in advanced logic and memory are growing in size and duration.

we see that the pace of the AI build-out continues to be very robust. Supply shortages across advanced logic and memory nodes continue to increase in size and in time horizon.

Fouquet says leading customers expect demand to exceed supply through at least 2028 and are accelerating capacity plans beyond that.

This extended visibility has led them to conclude that demand for their product will outpace supply through at least 2028. As a result, customers are accelerating capacity build-out plans and preparing for further expansion beyond 2028

Fouquet says orders for 2028 are increasing and customers want to order for 2029 and 2030.

We are increasingly receiving orders for 2028, and customers are also expressing interest in placing orders for 2029 and even 2030.

Fouquet says Zeiss is not a bottleneck for ASML's capacity expansion, even beyond 30% growth in 2028.

We do not see Zeiss today as a bottleneck for the capacity expansion we are discussing, even beyond the 30% we mentioned for 2028.

Fouquet says the demand is validated against customers' fab plans and is real, not inflated by panic buying.

When it comes to the demand we are referring to, the increased demand we are referring to, I think we are very much capable to validate that demand with some more detailed plan our customers are sharing with us in term of fab construction, release, et cetera. I think that when we talk about demand, when we refer to demand in those discussion, we really refer to demand we believe is real and not inflated by any potential buying behavior from our customer.

Fouquet expects High-NA tool numbers to grow every year as customers validate it and use it on more layers.

You are going to see that every year our customer are going to need more tool, as they validate in manufacturing that they like High-NA, and that most probably, they plan over time, more layers. But the number will grow for sure year after year.

Fouquet says value and pricing scale with throughput, so faster immersion DUV tools should capture value like EUV.

The price, the value scale basically with the throughput. I think what is true for EUV will be true also for Deep UV.

Fouquet says customers accepted that ecosystem value is shifting due to AI, but ASML does not plan annual price hikes.

there was a clear acceptance that maybe the overall value in the ecosystem is shifting. That's triggered by, of course, AI to some extent. Something we never did before, we don't want to do that every year because that's not the purpose.

Fouquet says the likelihood of major Chinese lithography competition remains low as long as ASML keeps market access.

as long as we have a good market access, as long as our customer can trust they can work with us, I think that the likelihood of a major competition in China is still pretty low. If you stick to fact, I think the fact this year are not different from the fact a year ago or even five years ago. So I think that the progress is not very strong.

Fouquet says AI chips need both memory and logic, with DRAM currently building capacity somewhat more aggressively.

I think you need both memory and logic to get some AI chips. I think today, DRAM is a bit more aggressive on the buildup of those capacity. But yeah, we have discussion with both.

Fouquet said ASML's current capacity expansion plans will not be enough to meet customer demand, with customers already eyeing 2029-2030 orders.

Chief executive Christophe Fouquet said at the same time that existing capacity expansion plans would not be sufficient to meet demand.

Fouquet said ASML's previously announced capacity increases will not be enough to meet customer demand, so the company is evaluating further expansion.

Chief Executive Christophe Fouquet said the capacity increases previously communicated would not be enough, and that ASML is therefore examining options for further expansion.

ASML CEO Fouquet dismissed reports of an imminent Chinese EUV rival, noting such predictions have recurred for 25 years.

We have been having this discussion about China having a tool to compete with us for the last 25 years. Every other year, we get news that this is coming.

Fouquet said that factually, China's EUV progress this year is no different from past years and has not been very strong.

If you stick to the facts, this year is no different from a year ago or even five years ago. I do not think the progress has been very strong.