Hotard预计半导体和内存供应将持续紧张到2028年,新内存晶圆厂要到2029年才投产。
限制来自台积电面临的需求(这点常被谈及)以及半导体供应链的其他环节。内存方面,现实是晶圆厂要到2029年才能建成投产。原文 (en)
"It's constraints in terms of the demand that TSMC has, which gets talked about quite a bit, and in other parts of the semiconductor supply chain," said Hotard. Hotard's expectation is that supply will remain "tight" into next year and even 2028 before there is much relief. "For things like memory, the reality is the fabs are not going to be completed and online until 2029."