Patel 认为 ASML 正在开发 D2W 混合键合设备,这是其垂直整合的自然延伸,将加强客户关系。
我们认为它将从芯片对晶圆(D2W)混合键合工具起步。这比晶圆对晶圆更难制造,但正是 ASML 可能获得优势的地方。我们将此举视为 ASML 垂直整合的自然延伸,并且应能加强其客户关系。原文 (en)
We believe it will start with a die-to-wafer (D2W) hybrid bonding (HB) tool. This is harder to build than wafer-to-wafer but is where ASML could gain an edge. We see the move as a natural extension of ASML’s vertical integration, and one that should strengthen its customer ties.