Patel 指出 D2W 混合键合因现有设备精度和吞吐量不足而进展缓慢,单颗成本高。
芯片对晶圆混合键合进展较慢,因为行业仍缺乏兼具满意对准精度和吞吐量的成熟设备(我们的调研显示当前应用上限仅为每小时一片晶圆),导致每颗芯片成本居高不下。原文 (en)
Die-to-wafer (D2W) HB is moving slower, because the industry still lacks mature tools that combine satisfying alignment accuracy and throughput (our check indicates upper bound in current applications is only one wafer per hour), which keeps cost per die high.