Patel 提醒 ASML 的轨道式键合设备仍需解决量测、接触、设备改造与洁净度等难题。
尽管有这些优势,ASML 仍需解决前馈量测、芯片与晶圆接触、改造非键合设备以便在轨道上处理芯片,以及保持整个回路洁净等挑战。原文 (en)
Despite the advantages, ASML still needs to solve challenges around feed-forward metrology, the die-to-wafer contact, the modification of the non-bonding tools so they can process dies on the track, and keeping the whole loop clean.