苏姿丰称 HBM 及零部件成本存在通胀,AMD 正与客户协商分担成本。
其他零部件成本也面临通胀压力,因为整个供应链投入了更多资本开支。我们也在与客户合作,确保这些成本在未来得到分担。原文 (en)
other component costs are also seeing some inflationary pressures in the sense of as there is more CapEx that's put into the overall supply chain environment. We are also working with our customers to include -- to ensure that those costs are shared as we go forward.