Fouquet 援引英特尔和三星的数据称 High-NA EUV 可大幅减少工艺步骤和周期时间,价值正在得到客户认可。
英特尔说明他们已在其设备上曝光超过 3 万片晶圆,并强调 High-NA 能帮助简化工艺,提到某一层的工艺步骤可从 40 步减至 10 步,这有助于周期、良率和工艺复杂度。三星在同一话题上也表示 High-NA 可将其周期缩短 60%。原文 (en)
Intel was explaining that they had exposed more than 30,000 wafer on their tool. They also pointed very strongly to the fact that INA could help them simplify their process and they mentioned one layer where they could reduce basically the number of process step from 40 to 10 which of course helps with uh cycle time yield and process complexity. Samsung also on the same topic said that INA could reduce their cycle time in fact by 60%.