Fouquet 认为 3D 集成是新机会,ASML 的整体光刻技术可迁移至该领域,XT260 先进封装设备是首款产品。
客户告诉我们 3D 集成需要创新,因为他们的要求会越来越严格。审视这些要求时,我们发现我们为整体光刻开发的许多技术可以迁移到 3D 集成上,这就是我们正在寻找多个机会的原因。原文 (en)
Our customer have told us that there is a need for innovation in 3D integration because their requirement will become more and more stringent. When we look at those requirements, we also see that a lot of the technology we have developed for holistic disography can be transferred to 3D integration and this is why we are looking at several opportunities.