马斯克称 ASML 等设备商正加快向 Terafab 项目交付设备,目标 2028 年第三或第四季度量产芯片,并坦言时间表极具雄心。
ASML 等设备厂商正在加快向特斯拉和 SpaceX 运营的 Terafab 项目交付设备。SpaceX 的目标是在 2028 年第三或第四季度实现大规模芯片量产,马斯克本人称这一时间点雄心极大。原文 (en)
ASML and other toolmakers were accelerating deliveries for the Terafab project run by Tesla and SpaceX. SpaceX is targeting high-volume chip production there in the third or fourth quarter of 2028 — a start date Musk himself called highly ambitious.