陈立武点名 ASIC、共封装光学、物理 AI 和先进封装为增长方向,目标是其中两三个各占约 10% 营收。
他点名 ASIC、共封装光学、物理 AI 和先进封装为潜在增长领域,并希望其中两三个最终各贡献英特尔约 10% 的营收。原文 (en)
He named ASICs, co-packaged optics, physical AI and advanced packaging as possible growth areas, and wants two or three of them to eventually bring in around 10% of Intel's revenue each.